Ceramic-to-Metal Feedthroughs
Tekna Seal manufactures brazed ceramic-to-metal assemblies for applications where a requirement for high operating temperature, high voltage withstanding, biocompatibility or special chemical resistance makes glass-to-metal seals unsuitable.
The sputter deposition metallization process allows the manufacture of very compact ceramic-to-metal assemblies and allows the metallization materials to be tailored to the requirements of the application and to the braze alloys to be used.
Two pin feedthrough
- Compact geometry
- Biocompatible materials
High density multiple pin feedthrough
- Compact pin spacing
- Excellent pin position accuracy
- Scalable pin count
- Economical production process
Common Materials of Construction:
| Application |
Housing |
Insulator |
Conductor Pin |
Braze |
| Material combination that has been successful in applications requiring biocompatibility |
Titanium |
99% Alumina ceramic |
Platinum
Platinum/Iridium
Niobium |
Gold |
| Electronic and general purpose |
Kovar |
Alumina |
Kovar or copper with Kovar transition |
Copper/silver alloys |
| High temperature |
Stainless steel with Kovar transition piece |
Alumina |
Kovar |
Gold alloys |
Typical Performance Specifications
Hermeticity: Less than 1 x 10 -9 Std cc/sec helium leak rate at 1 atmosphere pressure differential.
Electrical: Typical insulation resistance values > 1 gigaohm at 500 VDC, dependent on dimensions and proportions.
Temperature Withstanding: > 500° C dependent upon materials of construction.
View our Ceramic Seal Design Guidelines
