Tekna Seal manufactures brazed ceramic-to-metal assemblies for applications where a requirement for high operating temperature, high voltage withstanding, biocompatibility or special chemical resistance makes glass-to-metal seals unsuitable.
The sputter deposition metallization process allows the manufacture of very compact ceramic-to-metal assemblies and allows the metallization materials to be tailored to the requirements of the application and to the braze alloys to be used.
Two pin feedthrough
- Compact geometry
- Biocompatible materials
High density multiple pin feedthrough
- Compact pin spacing
- Excellent pin position accuracy
- Scalable pin count
- Economical production process
Common Materials of Construction:
|Material combination that has been successful in applications requiring biocompatibility
||99% Alumina ceramic
|Electronic and general purpose
||Kovar or copper with Kovar transition
||Stainless steel with Kovar transition piece
Typical Performance Specifications
Hermeticity: Less than 1 x 10 -9 Std cc/sec helium leak rate at 1 atmosphere pressure differential.
Electrical: Typical insulation resistance values > 1 gigaohm at 500 VDC, dependent on dimensions and proportions.
Temperature Withstanding: > 500° C dependent upon materials of construction.
View our Ceramic Seal Design Guidelines