Electronic and Photonic Packages

Leading-edge, high performance chips, MEMS devices, and photonic devices require packages with features and materials custom tailored to the application. Tekna Seal can provide custom housings as well as lids with integrated optical windows. Tekna Seal advantages: • Ability to use Metal-Injection-Molding to fabricate housings with tailored features and unconventional materials. • Ability to braze dissimilar metal or ceramic features into packages • Highest levels of hermeticity in MIM packages White Paper PDF: "Glass Sealing MIM Boxes for Fiberoptic and Electronic Packages" Do you need Acrobat Reader? Click Here

Ceramic to Metal Seals | Hermetic Feedthroughs | Hermetically Sealed Optical Windows
Glass-to-Metal Seals | Ceramic Seals | Lithium Battery Seal

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