Metal Injection Molded Hermetic Sealing
Hermetic packages used in electronic and photonic applications often require complex and precise geometry for alignment of critical components. Frequently these packages are machined from controlled expansion alloys such as Kovar or other nickel/iron alloys. Machined housings do not provide significant cost savings as production volumes increase.
- Achieve cost savings in moderate to high volume production
- Variety of materials such as Stainless Steel, Ni/Fe, Ni/Fe/Co, W/Cu, Mo/Cu
- Allows for modification of alloy percentages to adjust coefficient of thermal expansion over a wide range
- Allows for molded features that cannot be easily made in stamped bases such as W/Cu or Mo/Cu materials